Electronic Resource

Electrical Design of Through Silicon Via

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Penilaian

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Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

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Availability

Inventory Code	Barcode	Call Number	Location	Status
1408000230	EB0000375	621.381 5 Ele	Central Library	Available

Detail Information

Series Title

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Call Number

621.381 5 Ele

Publisher

Dordrecht Holland : Springer Dordrecht., 2014

Collation

ix, 280p.: Ill.

Language

English

ISBN/ISSN

978-94-017-9038-3

Classification

621.381 5

Content Type

Text

Media Type

-

Carrier Type

online resource

Edition

1

Subject(s)

Engineering
Computers, Special purpose

Specific Detail Info

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Statement of Responsibility

RTS

Other version/related

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