Electrical Design of Through Silicon Via
Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book cover…
- Edition
- 1
- ISBN/ISSN
- 978-94-017-9038-3
- Collation
- ix, 280p.: Ill.
- Series Title
- -
- Call Number
- 621.381 5 Ele
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