Electrical Design of Through Silicon Via
Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book cover…
- Edition
- 1
- ISBN/ISSN
- 978-94-017-9038-3
- Collation
- ix, 280p.: Ill.
- Series Title
- -
- Call Number
- 621.381 5 Ele
Search Result
Found 1 from your keywords: Author : "Kim, Joungho"
Query took 0.00057 second(s) to complete
Computer Science, Information & General Works 
Philosophy & Psychology 
Religion 
Social Sciences 
Language 
Pure Science 
Applied Sciences 
Art & Recreation 
Literature 
History & Geography