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Modeling and Application of Flexible Electronics Packaging

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This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.

Availability
Inventory Code Barcode Call Number Location Status
1908001858EB0002492621.381 Hua mCentral LibraryAvailable
Detail Information
Series Title
-
Call Number
621.381 Hua m
Publisher
Singapore : Springer Singapore.,
Collation
XVII, 287p.:Ill
Language
English
ISBN/ISSN
978-981-13-3627-0
Classification
621.381
Content Type
Ebook
Media Type
-
Carrier Type
online resource
Edition
1
Subject(s)
Flexible electronics
Specific Detail Info
-
Statement of Responsibility
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No other version available

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