Modeling and Application of Flexible Electronics Packaging
This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the ch…
- Edition
- 1
- ISBN/ISSN
- 978-981-13-3627-0
- Collation
- XVII, 287p.:Ill
- Series Title
- -
- Call Number
- 621.381 Hua m
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Found 1 from your keywords: Author : "Wan, Xiaodong"
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