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The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Availability

Inventory Code	Barcode	Call Number	Location	Status
1401001621	EB0001131	621.381 52 Lau s	Central Library	Available

Detail Information

Series Title: -
Call Number: 621.381 52 Lau s
Publisher: Singapore : Springer Singapore., 2022
Collation: XXII, 498p.:Ill
Language: English
ISBN/ISSN: 978-981-16-1378-4
Classification: 621.381 52
Content Type: Ebook
Media Type: -
Carrier Type: online resource
Edition: -
Subject(s): Semiconductors--Design and construction
Specific Detail Info: -
Statement of Responsibility: BRF

Other version/related

No other version available

File Attachment

Semiconductor Advanced Packaging

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