Semiconductor Advanced Packaging
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addre…
- Edition
- -
- ISBN/ISSN
- 978-981-16-1378-4
- Collation
- XXII, 498p.:Ill
- Series Title
- -
- Call Number
- 621.381 52 Lau s
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