Advances in Condition Monitoring and Structural Health Monitoring
This book comprises the selected contributions from the 2nd World Congress on Condition Monitoring (WCCM 2019), held in Singapore in December 2019. The contents focus on digitalisation for conditio…
- Edition
- -
- ISBN/ISSN
- 978-981-15-9199-0
- Collation
- xv, 795p.:Ill
- Series Title
- Lecture Notes in Mechanical Engineering
- Call Number
- 624.17 Adv
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Found 1 from your keywords: Author : Liew, Chin Kian (Edmund)
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