Image of SOLDER PASTE IN ELECTRONIC PACKAGING: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

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SOLDER PASTE IN ELECTRONIC PACKAGING: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

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Availability
Inventory Code Barcode Call Number Location Status
9501006256B13321S621.381 Hwa s 1992Central Library (CIRCULATION BKT)Available
Detail Information
Series Title
-
Call Number
621.381 Hwa s
Publisher
New York : Van Nostrand Reinhold.,
Collation
456 p. : ill. ; 23 cm
Language
English
ISBN/ISSN
0-442-20754-9
Classification
621.381
Content Type
Text
Media Type
unmediated
Carrier Type
-
Edition
-
Subject(s)
Printed Circuits-Design and Construction
Surface Mount Technology
Solder Pastes
Specific Detail Info
-
Statement of Responsibility
Other version/related

No other version available

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