APA Style
Hwang, Jennie S.. (1992).
SOLDER PASTE IN ELECTRONIC PACKAGING: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly .
New York:
Van Nostrand Reinhold.
Chicago Style
Hwang, Jennie S..
SOLDER PASTE IN ELECTRONIC PACKAGING: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly.
New York:
Van Nostrand Reinhold,
1992.
Text.
MLA Style
Hwang, Jennie S..
SOLDER PASTE IN ELECTRONIC PACKAGING: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly.
New York:
Van Nostrand Reinhold,
1992.
Text.
Turabian Style
Hwang, Jennie S..
SOLDER PASTE IN ELECTRONIC PACKAGING: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly.
New York:
Van Nostrand Reinhold,
1992.
Print.