APA Style
Kim, Jieun, Jeong, Buyong, Kim, Daejung. (2021).
Patent Analytics (1).
Singapore:
Springer Singapore.
Chicago Style
Kim, Jieun, Jeong, Buyong, Kim, Daejung.
Patent Analytics.
1
Singapore:
Springer Singapore,
2021.
Electronic Resource.
MLA Style
Kim, Jieun, Jeong, Buyong, Kim, Daejung.
Patent Analytics.
1
Singapore:
Springer Singapore,
2021.
Electronic Resource.
Turabian Style
Kim, Jieun, Jeong, Buyong, Kim, Daejung.
Patent Analytics.
1
Singapore:
Springer Singapore,
2021.
Electronic Resource.