APA Style
Noia, Brandon, Chakrabarty, Krishnendu. (2013).
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs (1).
Switzerland:
Springer Cham.
Chicago Style
Noia, Brandon, Chakrabarty, Krishnendu.
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs.
1
Switzerland:
Springer Cham,
2013.
Electronic Resource.
MLA Style
Noia, Brandon, Chakrabarty, Krishnendu.
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs.
1
Switzerland:
Springer Cham,
2013.
Electronic Resource.
Turabian Style
Noia, Brandon, Chakrabarty, Krishnendu.
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs.
1
Switzerland:
Springer Cham,
2013.
Electronic Resource.