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Systems-Level Packaging for Millimeter-Wave Transceivers

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This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.

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Inventory Code Barcode Call Number Location Status
1908002122EB0002828621.384 Boz sCentral Library (OPAC)Available
Detail Information
Series Title
Smart Sensors, Measurement and Instrumentation
Call Number
621.384 Boz s
Publisher
Switzerland : Springer Cham.,
Collation
xv, 277p.:Ill
Language
English
ISBN/ISSN
978-3-030-14690-0
Classification
621.384
Content Type
Ebook
Media Type
-
Carrier Type
online resource
Edition
1
Subject(s)
Millimeter wave communication systems
Specific Detail Info
-
Statement of Responsibility
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No other version available

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