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Design for Manufacturability: From 1D to 4D for 90–22 nm Technology Nodes

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This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes. It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package.

Availability
Inventory Code Barcode Call Number Location Status
1408000602EB0002742621.381 Bal dCentral Library (OPAC)Available
Detail Information
Series Title
-
Call Number
621.381 Bal d
Publisher
New York : Springer New York, NY.,
Collation
viii, 278
Language
English
ISBN/ISSN
978-1-4614-1761-3
Classification
621.381
Content Type
Ebook
Media Type
-
Carrier Type
online resource
Edition
1
Subject(s)
Electronic circuit design
Linear integrated circuits--Design
Specific Detail Info
-
Statement of Responsibility
Other version/related

No other version available

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