APA Style
Huang,YongAn, Yin,Zhouping, Wan, Xiaodong. (2019).
Modeling and Application of Flexible Electronics Packaging (1).
Singapore:
Springer Singapore.
Chicago Style
Huang,YongAn, Yin,Zhouping, Wan, Xiaodong.
Modeling and Application of Flexible Electronics Packaging.
1
Singapore:
Springer Singapore,
2019.
Electronic Resource.
MLA Style
Huang,YongAn, Yin,Zhouping, Wan, Xiaodong.
Modeling and Application of Flexible Electronics Packaging.
1
Singapore:
Springer Singapore,
2019.
Electronic Resource.
Turabian Style
Huang,YongAn, Yin,Zhouping, Wan, Xiaodong.
Modeling and Application of Flexible Electronics Packaging.
1
Singapore:
Springer Singapore,
2019.
Electronic Resource.