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Copper Wire Bonding

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Penilaian

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This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components.

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Availability

Inventory Code	Barcode	Call Number	Location	Status
1408000507	EB0002285	621.381046 Cho c	Central Library (OPAC)	Available

Detail Information

Series Title

-

Call Number

621.381046 Cho c

Publisher

New York : Springer New York, NY., 2013

Collation

xxvi, 235p.: Ill.

Language

English

ISBN/ISSN

978-1-4614-5761-9

Classification

621.381046

Content Type

Ebook

Media Type

unmediated

Carrier Type

-

Edition

1

Subject(s)

Wire bonding (Electronic packaging)

Specific Detail Info

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Statement of Responsibility

RIZAL

Other version/related

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