Image of Thermomechanics & Infrared Imaging, Inverse Problem Methodologies and Mechanics of Additive & Advanced Manufactured Materials, Volume 7

Electronic Resource

Thermomechanics & Infrared Imaging, Inverse Problem Methodologies and Mechanics of Additive & Advanced Manufactured Materials, Volume 7

Penilaian

0,0

dari 5
Penilaian anda saat ini :  

Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 7 of the Proceedings of the 2020 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the seventh volume of sseven from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including:
Test Design and Inverse Method Algorithms

Inverse Problems: Virtual Fields Method

Residual Stresses: Measurement, Uncertainty & Validation

Residual Stresses: Eigenvalues, Modeling, & Crack Growth

Material Characterizations Using Thermography

Fatigue, Damage & Fracture Evaluation Using Infrared Thermography

Availability
Inventory Code Barcode Call Number Location Status
1908000774EB0001354620.11 ManCentral Library (OPAC)Available
Detail Information
Series Title
Conference Proceedings of the Society for Experimental Mechanics Series
Call Number
620.11 Man
Publisher
Switzerland : Springer Cham.,
Collation
viii, 104p.:Ill
Language
English
ISBN/ISSN
978-3-030-59864-8
Classification
620.11
Content Type
Ebook
Media Type
-
Carrier Type
online resource
Edition
1
Subject(s)
materials
Specific Detail Info
-
Statement of Responsibility
Other version/related

No other version available

File Attachment
Comments
You must be logged in to post a comment