APA Style
Lau, John H.. (2022).
Semiconductor Advanced Packaging .
Singapore:
Springer Singapore.
Chicago Style
Lau, John H..
Semiconductor Advanced Packaging.
Singapore:
Springer Singapore,
2022.
Electronic Resource.
MLA Style
Lau, John H..
Semiconductor Advanced Packaging.
Singapore:
Springer Singapore,
2022.
Electronic Resource.
Turabian Style
Lau, John H..
Semiconductor Advanced Packaging.
Singapore:
Springer Singapore,
2022.
Electronic Resource.